Fully Automated Laser Depaneling Machine, Dual-Platform, Zero Stress, <80µm Precision
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$1.00
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- Zero Mechanical Stress – 0µE
- High Repeatability with No Shape Limitations
- Ultra-Dense Cutting – Capable of ultra-narrow pitch cutting (<80µm)
- Comprehensive Substrate Compatibility – Supports FPC, FR4, LTCC, HTCC, Al2O3, AlN, PI
- Cutting Efficiency – Up to 100mm/s
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