3D Solder Paste Inspection (SPI) System with White Light PMP Technology, ≤1 μm Repeatability for SMT PCB Inspection
Regular price
$1.00
- High-Accuracy 3D Measurement: utilizes advanced white-light PMP technology to accurately inspect solder paste volume, height, area, shape, and XY offset, ensuring reliable process control throughout SMT production
- Fast and Reliable Inspection: delivers inspection speeds as fast as 0.35-0.5 sec/FOV while maintaining excellent repeatability of ≤1 μm and volume/area variation below 1%
- Fine-Pitch Component Capability: supports inspection of ultra-small components down to 01005 and optional 03015 packages, making it suitable for high-density and advanced PCB assemblies
- Intelligent Quality Control: automatically detects solder defects including insufficient paste, excess paste, bridging, misalignment, shape abnormalities, and board contamination, helping reduce production defects
- Flexible Integration and Data Analysis: supports Gerber and CAD import, comprehensive SPC analysis tools, barcode integration, and centralized management options for efficient SMT process monitoring and optimization
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- High-Accuracy 3D Measurement: utilizes advanced white-light PMP technology to accurately inspect solder paste volume, height, area, shape, and XY offset, ensuring reliable process control throughout SMT production
- Fast and Reliable Inspection: delivers inspection speeds as fast as 0.35-0.5 sec/FOV while maintaining excellent repeatability of ≤1 μm and volume/area variation below 1%
- Fine-Pitch Component Capability: supports inspection of ultra-small components down to 01005 and optional 03015 packages, making it suitable for high-density and advanced PCB assemblies
- Intelligent Quality Control: automatically detects solder defects including insufficient paste, excess paste, bridging, misalignment, shape abnormalities, and board contamination, helping reduce production defects
- Flexible Integration and Data Analysis: supports Gerber and CAD import, comprehensive SPC analysis tools, barcode integration, and centralized management options for efficient SMT process monitoring and optimization
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